Technical Articles

• How to Avoid EMC Problems in PCB Design

  Electromagnetic Compatibility (EMC), Signal Integrity (SI), and Power Integrity (PI) are closely related. We must maintain SI & PI performance and consider stack-up & shield isolation in order to avoid EMC problems when laying out a PCB. Source ：Edadoc 2018/11/3>>Detail

• Switching vs. Linear Regulators

  We will analyze the pros and cons of Switching regulators (DC-to-DC) and Linear regulators (LDO) in order to determine the best option for PCB Design.  Source ：Edadoc 2018/9/17>>Detail

• Flexible Circuit Component Assembly and a Math Lesson.

  The market for rigid PCBs is estimated to be about 10x the market size for flexible printed circuits (FPCs). As a result, the equipment infra-structure is driven primarily by the needs of the rigid board market. This is true of both equip-ment used to fabricate the circuitry (image, etch, copper plate, AOI, etc.) and equipment used for component assembly (wave solder and SMT assembly).
  Source ：Edadoc 2018/3/2>>Detail

• Process Engineering: PCB Manufacturing’s “Delta Force”

  The role of the process engineer is arguably one of the most important jobs in the printed circuit industry. The process engineer is on the front line of manufacturing and responsible for making sure product yields and profitability meet expectations. Source ：Edadoc 2017/4/12>>Detail

• The Evolution of FR-4

  In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications. Source ：Edadoc 2016/5/6>>Detail

• Why Copper is Ideal for Flexible Circuitry?

  While copper may not rank the best in any one of the above criteria, it probably has the best overall rating.
  Source ：Edadoc 2016/4/14>>Detail

• Design for Test in the U.S. Market.

  With most high-volume printed circuit assembly being sent outside the United States, we have a unique challenge for testing the lower volume/high turnover assemblies domestically. However, with a little planning and the right contract manufacturer (CM), test does not need to be an issue. Source ：Edadoc 2016/4/7>>Detail

• Why Do Different Test Methods Yield Different Electrical Values?

  A variety of different test methods may be used for any one electrical concern. This article will discuss the issues related to determining the dielectric constant (Dk) and dissipation factor (Df or Tan-Delta). Source ：Edadoc 2016/3/30>>Detail

• 3D Assembly Processes: A Look at Today and Tomorrow

  Printed circuit board assembly (PCBA), starting with the plated through-hole, later evolving to surface mount assembly, have been planar in two dimensions. Components are mounted onto the PCBA in the x and y direction, where the height, z direction, is controlled by the component height.
  
  
  Source ：Edadoc 2016/3/2>>Detail

• How does the EDADOC PCBA factory work?

  How does the EDADOC PCBA factory work with 12 SMT lines? Edadoc PCBA factory devoted to cooperate with our clients, thus offers great product experience to end customers.
  Source ：Edadoc 2016/2/25>>Detail