PCB Fabrication Capability
|
|
Item
|
Technical Parameter
|
|
Layer
|
2-64
|
|
Thickness
|
0.6-10mm
|
|
Copper Thickness
|
0.3-12 oz
|
|
Min Mechanical Hole
|
0.1mm
|
|
Min Laser Hole
|
0.075mm
|
|
HDI
|
1+n+1、2+n+2、3+n+3
|
|
Max Aspect Ratio
|
18:1
|
|
Max Board Size
|
610mm*1100mm
|
|
Min Width/Space
|
2.4/2.4mil
|
|
Min Outline Tolerance
|
±0.1mm
|
|
Impedance Tolerance
|
±5%
|
|
Min PP Thickness
|
0.06mm
|
|
Bow & Twist
|
≤0.5%
|
|
Materials
|
FR4、High-TG 、Rogers、Nelco、RCC、PTFE
|
|
Surface Finished
|
HASL、HASL Pb Free
Immersion Gold/Tin/Silver
OSP、Immersion Gold + OSP
|
|
Special Capability
|
Gold Finger Plating 、Peelable、Carbon ink
|
|
|
Lead time
|
|
Layer
|
Prototype
|
Mass prduction
|
Quick Turn
|
|
2L
|
5days
|
9days
|
48h
|
|
4L
|
5days
|
10days
|
3days
|
|
6L
|
6days
|
12days
|
3days
|
|
8L
|
7days
|
12days
|
4days
|
|
10L
|
10days
|
14days
|
4days
|
|
12L
|
10days
|
14days
|
5days
|
|
14L
|
12days
|
16days
|
6days
|
|
16L
|
12days
|
16days
|
6days
|
|
18L
|
14days
|
18days
|
6days
|
|
20L
|
14days
|
18days
|
8days
|
|
22L
|
14days
|
20days
|
8days
|
|
24L
|
14days
|
20days
|
8days
|
|
26L
|
14days
|
20days
|
10days
|
|
28L
|
14days
|
20days
|
10days
|
|
30L
|
14days
|
20days
|
10days
|
|
32L
|
14days
|
20days
|
10days
|
|
