EDADOC Spotlights PCB High-speed Interconnection Technology at DesignCon
<<BackSource:Edadoc Time:2018/2/5
The annual PCB high-speed industry exhibition DesignCon came to an end.
In DesignCon, EDADOC showcased its research achievement in PCIE4.0, 56G, PAM4, which attracted the attention from Intel, Cisco, Apple and other senior hardware company. At the same time, EDADOC’s one-stop hardware innovation platform providing PCB layout, fabrication, assembly and parts sourcing, also attracted the attention of countless hardware engineers and procurement engineers. The one-stop platform provides a hassle free solution, greatly enhances customers’ development ability and research speed, dedicated to be customer’s best partner.
In DesignCon, EDADOC showcased its research achievement in PCIE4.0, 56G, PAM4, which attracted the attention from Intel, Cisco, Apple and other senior hardware company. At the same time, EDADOC’s one-stop hardware innovation platform providing PCB layout, fabrication, assembly and parts sourcing, also attracted the attention of countless hardware engineers and procurement engineers. The one-stop platform provides a hassle free solution, greatly enhances customers’ development ability and research speed, dedicated to be customer’s best partner.
