After engineers talked to engineers and business cards have been exchanged, DesignCon2016 has come to the end. Edadoc met many old friends and made some new friends during this exhibition.

Conference attendees gathered the latest theories, methodologies, applications and advanced design tools related to signal integrity, power integrity, jitter, crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more.

Huawei, ZTE, Edadoc and other Chinese leading firms in high speed PCB design area set off a second Chinese technology show on Designcon2016 after CES. High speed test boards based on TRL and some latest research results in RF field from Edadoc attracted many professionals from Cisco, Apple and Google etc.

Edadoc is very grateful for the supports from who visited our booth. DesignCon2016 has come to an end, but Edadoc is still keeping move, hope we all get better when we meet at next year!