TYPEⅢ HDI PCB Design for OMAP4430 Platform

Source: Time:2014/8/27

【TYPE】：	TYPEⅢ HDI PCB Design for OMAP4430 Platform
【Difficulty】：	There are two 0.4 mm pitch IC in this design with extreme density. So we have to choose TYPEⅢ HDI PCB design. This project is a reference designs board of Intel. The quality and schedule are both very important.
【Solution】：	In this project, with the experienced in PCB design and manufacture, EDADOC provide many Suggestions to help customers reduce the restrictions in batch production process. At the same time, EDADOC realize the 24 hours continuous work teamwork between North America and China site. Ensure the schedule of this project.
【Result】：	Finally this project is successful in first prototype. Reduce the time to market and earn the good opportunities. This design become benchmarking of EDADCO for TYPEⅢ HDI PCB Design.

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